Assembleon Topaz X II

Assembleon Topaz-X II – Pick & Place usata-ricondizionata.
Parte della GemLine (Modular High Speed Produccion Machines), la Topaz-X II è una macchina in grado di gestire un’ampia gamma di componenti con velocità fino a 18.000 SMD all’ora in un range da 01005 (0402) a 45 x 100mm con una precisione di 40 micron (QFP).

Un sistema flessibile di trasporto delle schede consente a che Topaz-X di gestire praticamente qualsiasi tipo di PCB, con o senza pin di attrezzaggio. La larghezza del trasportatore di schede è regolabile automaticamente, consentendo di gestire schede di dimensioni fino a 460 x 440 mm (I 7,9″ x 17,2″).

Usato – ricondizionato


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    Ripristino totale

    Model: Assembleon Topaz X2

    Category: Pick and Place/Feeders

    Model Year: 2005

    Condition: refurbished

    Location: Italy – Padua

    _______________________________

    Optimal placement rate: 22,000 cph
    Nominai placement rate: 15,400 cph
    Applicable components: 0402 – SOP, SOJ, PLCC 32mm ( 1.26″)
    6mm – QFP 32mm  ( 1.26″) with pin pitch down to 0.5mm (20 mii)
    Dark background BGA, μBGA, CSP with regular pitches;
    6mm – 32mm: Min. ball pitch down to 0.75mm (31 mii}, Min.
    ball diameter down to 0.3mm (I 2mil)
    6mm – QFP 32mm (1.26″) with pin pitch down to 0.4mm (16 mii)
    Dark background BGA, μBGA,CSP with regular pitches;
    6mm – 32mm: Min. ball pitch down to 0.75mm (31 mii}, Min.
    ball diameter down to 0.3mm (I 2mil)
    Mounting accuracy (XY) 3σ: ± 50μ for chips and SOIC
    ± 40μ for QFPs ( 6mm – 32mm 1.26″) with pin pitch down to 0.5mm (20 mii)
    ± 35μ for QFPs (6mm – 32mm 1.26″) with pin pitch down to 0.4mm ( 16 mii)
    Mounting accuracy

    (φ):

    For Chips and SOIC this is Lead dependent
    ± 0.6° for QFPs (6mm – 32mm 1.26″) with pin pitch down to 0.5mm (20 mii)
    ± 0.09° for QFPs (6mm – 32mm 1.26″) with pin pitch down to 0.4mm ( 16 mii)
    Mounting angle: O up to 360 (programmable in steps of O.O I )
    Mounting repeatability: X, Y 30μ for QFPs (6mm – 32mm 1.26″) pitch 0.4 Phi (0.09°)
    Number of heads: One single beam with 4 Flying Nozzle change heads and 4 standard heads
    Alignment system: One line array camera with fore and side illumination system for
    Vision on the Fly using the VICS 2500 processing system
    Area CCD camera for QFP 32mm ( 1.26″) with pin pitch
    down to 0.4mm ( 16 mii)
    Moving CCD camera for Fiducia! alignment

    Optional:

    • Doppia multicamera bancata anteriore e posteriore
    • Nozzle station
    • Trolley FES
    • 8 Standard Heads

    Available 1 machine

    Macchinario

    Pick & Place

    Marchio

    Assembleon, Philips, Yamaha